Item Type: Thermoelectric Cooler Module Model: TES1-04903 Material: Ceramic Rated Voltage: DC5V Maximum Voltage: DC5.78V (Th=30) Maximum Current: 3A (U=5.78V, Th=30) Maximum Temperature Difference: 66 (Qc=0,Th=30) Maximum Cooling Capacity: 9.5W (T=0,Th=30) Internal Resistance: 1.27-1.43 Lead Specification: 22AWG, L: Approx. 150mm / 5.9in Packaging Process: 704 silicone rubber seal Assembly Pressure: 4kg Working Temperature: -50~+80 Storage Temperature: -40~+60 Application Range: 1. Applications in High-Tech Fields: Satellites, semiconductor lasers, infrared thermal imaging, infrared detectors, optoelectronic devices, etc. 2. Home Appliance Applications: Dehumidifiers, portable heating and cooling boxes, hot and cold water dispensers, cool helmets, cold drink cups, beverage wine coolers, etc. 3. Application in Electronic Technology: Cooling of electronic equipment, electronic components, computers, etc. 4. Industrial Applications: Automobile refrigerators, small air conditioners, dehumidifiers, thermostats, petroleum testing instruments, etc. 5. Agricultural and Biological Applications: Physical cooling pads, semiconductor physiological slices, vaccine preservation, etc. Outer Diameter: Approx. 26mm / 1in Inner Diameter: Approx. 10mm / 0.4in1Does not need any refrigerant, can work continuously, there is no pollution source, no rotating parts, no rotation effect, no sliding part. A solid piece without vibration, noise, possess long life and easy installation 2Semiconductor refrigeration fins have two functions, both cooling and heating. The cooling efficiency is generally 55-60%, but the heating efficiency is very high and always greater than 1. Therefore, one piece can replace separate refrigeration system and heating system 3The semiconductor refrigeration chip is a current-transducer type chip. Through the control of the input current, high-accuracy temperature control can be realized. Coupled with temperature detection and control means, it is easy to realize remote control, program control, and computer control to form an automatic control system 4The thermal inertia of the semiconductor cooling fin is very small, and the cooling and heating time is very fast. When the hot end has good heat dissipation and the cold end is empty, the cooling fin can reach the maximum temperature difference in less than one minute 5The reverse use of semiconductor refrigeration fins is thermoelectric power generation. Semiconductor refrigeration fins are generally suitable for power generation in the middle and low temperature areas 6The power of a single refrigeration component pair of a semiconductor refrigeration chip is very small, but when combined into a stack, and the same type of stack is used in series and parallel to form a refrigeration system, the power can be very large, so the cooling power can be several Milliwatts to tens of thousands of watts 7The temperature resistance of the semi?conductor refrigeration sheet is 80 degrees on the hot side at normal temperature, 150 degrees on the medium temperature hot side, and 200 degrees on the high temperature hot side; the temperature difference between the hot end and the cold end can reach 67 degrees at the first level and 80 degrees at the second level. Level three reaches 90 degrees, level four reaches 107 degrees1 x Thermoelectric Cooler Module