Item Type: Thermoelectric Cooler Module Model: TEC1-12710 Material: Ceramic + semiconductor Purpose: Cooling Dimension: Approx. 40 x 40 x 3.6mm / 1.6 x 1.6 x 0.1in Wire Specification: Wire Length: Approx. 100mm / 3.9in 5mm, RV standard wire, single head approx. 5mm / 0.2in with tin plated Internal Resistance: 2.4~2.7 (ambient temperature 231, 1kHZ Ac test) Maximum Temperature Difference: Tmaximum(Qc=0)>61 Working Current: Imaximum=10A (when the rated voltage starts) Rated Voltage: DC12V (Vmaximum: 15.4V) Cooling Power: 76.3W Assembly Pressure: 85N/cm2 Working Environment: Temperature range -6567 (too high ambient temperature will directly affect the cooling efficiency) Ambient Temperature: -1040 How to Use: 1. The working state of the refrigeration sheet is that one side is cooling and the other is heating. 2. To the left of the red line, the upper side is the hot side, and the lower side is the cold side. 1Work continuously does not need any refrigerant, there is no pollution source or rotating parts, no rotation effect, no sliding part. A solid piece without vibration, noise, possess long life and easy installation 2Semiconductor refrigeration film have two functions, support both cooling and heating 3This is a current?transducer type chip. High?accuracy temperature control can be realized through the control of the input current. Coupled with temperature detection and control means, it is easy to realize remote control, program control, and computer control to form an automatic control system 4The thermal inertia of the semiconductor cooling fin is very small, so that cooling and heating time is very fast, the cooling fin will reach the maximum temperature difference in less than one minute when the hot end has good heat dissipation and the cold end is empty 5Reverse use of semiconductor refrigeration fins is thermoelectric power generation. Semiconductor refrigeration fins are generally used for power generation in the middle and low temperature areas1 x Thermoelectric Cooler Module