Description 1. Made of high-purity, lead-free, environmentally friendly materials with low impurities and balanced composition, ensuring full and reliable solder joints on the surface of the tin wire. 2. Low melting point reduces thermal shock to components during welding, offers high insulation resistance, stable performance, and safe operation. 3. Excellent wettability and spreadability, effectively prevents bridging and ensures quick, clean tinning. 4. Efficient deoxidation properties help form a protective oxide film on the solder joint surface after welding, slowing down oxidation and maintaining bright, clean joints. 5. Advanced flux formulation produces minimal spatter, low smoke, and no odor during welding. 6. Leaves minimal residue, compatible with cleaning and assembly processes, features smooth winding for good feedability and ease of use. 7. Suitable for engineering circuit board welding, computer motherboard repair, mobile phone electronics, aviation industry circuit boards, automatic soldering machines, and DIY electronics projects. Specifications: - Color: As shown - Material: Copper-tin alloy - Wire diameter: 1.0 mm - Weight: 100 g - Alloy composition (by weight): Sn99.3 Cu0.7 - Flux content: 2.2% ± 0.3% - Melting point range: 227°C - Halogen content: None - Density: 7.4 g/cm³ - Working temperature: 380 ± 20°C Package Includes: 1 x Solder Wire