Spacesaving vertical design The compact vertical form factor occupies less space on the PCB, helping you create tighter, more efficient layouts. Reliable assembly and operation A special guide pin structure reduces the likelihood of opencircuit conditions during insertion and use, improving reliability in manufacturing and final assembly. frequency performance Low distributed capacitance and a selfresonant frequency support stable operation in frequency applications. Broad compatibility and general use Designed to meet a wide range of common needs, and suitable for integration with standard PCB processes and footprints. Key attributes Function: frequency component with a compact footprint Size: vertical, spaceefficient design Performance: low distributed capacitance, selfresonant frequency Reliability: guide pin structure minimizes opencircuit risks Compatibility: suitable for typical PCB layouts and assemblies Applications and scenarios In compact handheld devices and wearables where space is at a but RF performance is important In RF frontend modules, impedance matching networks, and compact filters requiring stable frequency behavior In generalpurpose electronics prototyping and small consumer electronics where reliable performance and small footprint are needed