CPU bending correction buckle for LGA1700/1800 with TF7 thermal pad 1. Compared with other similar products, this product adopts four-sided flat pressure instead of multi-point pressure, precise positioning, avoiding capacitors, and is good for CPU fixation;<br> 2. The contact surface with the motherboard is a flat bottom, and the LOTES insulation protection pads of the same specification are used to reduce the pressure on the motherboard and further reduce signal interference;<br> 3. The metal side is raised to reduce signal interference on the motherboard side;<br> 4. Anode sandblasting is made of all-aluminum alloy CNC precision;<br> 5. This product only provides support for 12th generation CPU, the motherboard CPU socket is LGA1700 chipset is H610 B660 Z690 series.<br> Weight: main body 20g<br> Installation process:<br> 1. Place the motherboard horizontally on the desktop and open the CPU clip<br> 2. Use the included T20 Torx screwdriver to remove the upper part, and put the lower fastener<br> 3. Put the CPU into the socket<br> 4. Cover the improved buckle on the top cover of the CPU and move it slightly until it clicks into place<br> 5. Tighten the screws in half a circle on the opposite corners. Each screw takes turns in half a circle and a half circle in the diagonal order until the screw is on. , will put pressure on the CPU unevenly<br> Colour:black<br> Material:Aluminum alloy<br> Size:70 x 54 x 6mm<br> Package Contents:<br> 1 x LGA17XX-BCF CPU Bending Corrector Frame<br> 1 x L-shaped screwdriver<br> 1 x TF7<br> Only the above package content, other products are not included.<br> Note: Light and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.